- EPIC Advanced Packaging marks an expansion of Applied’s global innovation platform
- Company convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies
Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. To kick-off the initiative, Applied convened more than two dozen top R&D leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies and research institutes. The goal is to fast-track new technologies for the next generation of energy-efficient computing. Applied hosted the summit in Singapore, where the company has been collaborating on advanced packaging R&D with its customers and partners for over a decade.
The dramatic rise in the number of connected devices and the emergence of AI are creating tremendous growth opportunities for the chip industry. At the same time, the industry is confronting several challenges, foremost of which is the exponential increase in energy consumption fueled by the intense compute power required to support the growth of AI. In response, chipmakers and system designers are increasingly turning to advanced packaging and heterogeneous integration of multiple chips as a way to achieve more energy-efficient system performance.